![]() ![]() Note: These PCB profiles were made in an oven that has been verified to have a consistent temperature across the oven conveyor within ±5☌. Here TC2 can be identified as an area of high thermal inertia, and TC1 as an area of low thermal inertia. distance, the graph becomes more intuitive (See Figure 3). time plot to be somewhat confusing.īy plotting the same data as temperature vs. This separation is typical and causes the resulting temperature vs. Notice that TC2 enters the oven 5” behind TC1, and TC3 enters the oven 3” behind TC2. Plotting the PCB Thermal Profileįigure 2 shows the placement of three TCs on a PCB and a plot of the resulting thermal profiles. However, this method requires a sacrificial PCB. Typically, 10‑88‑2 solder with a melting point of 286☌ is the most reliable means of attaching the thermocouples. Although Kapton tape is the quickest and simplest method of attaching thermocouples to a PCB, this method is not recommended as it often generates serious random temperature errors. It is attached to the PCB with Kapton Tape, thermally conductive adhesive or high temperature solder. The highest peak is found near its bare edges and the lowest peak is found at larger components, near the center of the PCB. The thermocouples are positioned on the PCB to find the highest and lowest peak temperatures. PCB temperature is typically measured by attaching thermocouples to different areas on the PCB. ![]() The PCB thermal profile is determined by temperature, time, and heat transfer rate. time of the PCB as it travels through the oven. Thermal profiling is the process of plotting temperature vs. #REFLOW OVEN TEMPERATURE SERIES#In a typical solder reflow oven, the PCB enters one end of the oven and moves at a constant speed through a series of temperature controlled zones (See Figure 1). Understanding how the modern solder reflow oven works and the basic principles of conveyorized heat treatment can ease the job of oven setup, i.e. To achieve high quality solder joints, all the variables regarding the solder reflow process must be controlled. One of the main problems faced in Printed Circuit Board (PCB) assembly applications is the initial setting up, and the continuing control of the solder reflow process to obtain optimal process yield. The Science Behind Conveyor Oven Thermal Profiling ![]()
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